Talent War Webinar: How can Europe avoid being left behind?

We are delighted to invite you to a webinar titled Talent War: How can Europe avoid being left behind? This is hosted under the banner of our successor project – the European Chips Skills Academy and will take place on…

METIS at SEMICON Europa

We were delighted to see the METIS project featured at SEMICON Europa in Munich in November. SEMICON is the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. Promotional material related…

METIS Final Event

All good things come to an end, and this week saw the culmination of the METIS project that began in 2019. With 18 partners from a number of European countries, the consortium worked tirelessly to address the skills shortage to…

Event: METIS Final Results and the launch of the European Chips Skills Alliance

It is our pleasure to invite you to the final event of the METIS project: Advancing Skills and Talent in the Semiconductor Industry – Final Results and the launch of the European Chips Skills Alliance due to take place in…

Join the EU Digital Future Forum Webinar

We are delighted to invite you to attend the EU Digital Future Forum Webinar, taking place on November 6, at 9am CET. The webinar will feature speakers not only from METIS but also from other EU-funded projects in the industry…

Join the European Chips Skills Alliance

The METIS consortium has the ambition to develop a sustainable structure for collaboration and is currently setting out a long-term action plan for the skills development of the microelectronics industry, driven by industry and academia.  In support of this, the European Chips Skills Alliance…

EU Chips Skills Alliance Webinar

We are delighted to let you know that Silicon Saxony, a METIS consortium member, is hosting a webinar on the EU Chips Skills Alliance on September 28, at 3pm CEST. This event will introduce an evolving EU Chips Skills Alliance…

METIS at 3D & Systems Summit 2023

The recently concluded 3D & Systems Summit 2023, held in Dresden, Germany, included material that promoted METIS. The SEMI 3D & Systems Summit was dedicated to Smarter Systems through Heterogeneous Integration. Industry experts shared their insights into 3D and Heterogeneous…

Recognize the benefits brought by METIS: Letter of endorsement now open

The METIS consortium invites stakeholders to complete a letter of endorsement in relation to the project. By signing the letter of endorsement, you will support the continuation of the training courses and related efforts beyond the lifetime of the project…

METIS at the 46th International Spring Seminar on Electronics Technology

METIS was featured at the 46th International Spring Seminar on Electronics Technology, organized by the Polytechnic University of Timisoara, and held between 10 and 14 May, 2023. The International Spring Seminar on Electronics Technology (ISSE) is the IEEE-EPS flagship conference…

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