16th SiSAX Day

28th June at International Dresden Airport On June 28, the 16th Silicon Saxony Day will take place at International Airport Dresden. In addition to CEOs and decision-makers from numerous ICT companies, researchers, scientists, engineers, politicians, developers and buyers from all…

ERACON 2022

27 June – 1 July in Thessaloniki, Greece The European Association of Erasmus Coordinators (EAEC), announces the 18th annual Erasmus Congress and Exhibition – ERACON 2022 (www.eracon.info). Erasmus Coordinators, Placement and Internships Managers, Researchers and Professionals with an interest in…

Webinar Series: 30 minutes with tech experts

BRUSSELS, Belgium – March 18, 2022.  Take your career to the next level and register for a new webinar series at Infineon. Get unique insights into pioneering technologies and learn more about the materials SiC and GaN, unit process development and Silicon Carbide power...

Digital sovereignty: Commission proposes Chips Act to confront semiconductor shortages and strengthen Europe’s technological leadership

European Commission Press Release, February 8, 2022, Brussels Today, the Commission proposes a comprehensive set of measures to ensure the EU’s security of supply, resilience and technological leadership in semiconductor technologies and applications. The European Chips Act will bolster Europe’s competitiveness, resilience…

The METIS consortium releases its report “METIS Skills Strategy” (Deliverable 2.3)

BRUSSELS, Belgium – December 2, 2021. The METIS consortium releases the report “METIS Skills Strategy” (D2.3). Download the Deliverable Report here. The METIS consortium releases its report “METIS Skills Strategy” (Deliverable 2.3) today. This report identifies the trends, challenges and opportunities associated to the skills needs in the European microelectronics…

The METIS Consortium releases its report “Skills and Occupational Profiles for Microelectronics” (Deliverable 2.2)

BRUSSELS, Belgium – December 2, 2021. The METIS consortium releases the report “Skills and Occupational Profiles for Microelectronics” (D2.2). Download the Deliverable Report here. The METIS consortium releases its report “Skills and Occupational Profiles for Microelectronics” (Deliverable 2.2). This report consists of the monitoring and anticipation of skills needs in the European microelectronics industry. …

METIS – MicroElectronics Training, Industry and Skills at SEMICON Europa

Thursday, November 18 | 10:00 am – 11:30 am Building a Strong Electronics Talent Pipeline Electronics, as one of the most R&D-intensive sectors in the world, requires a workforce that can efficiently harness the potential of new technologies, such as…

SEMI Applauds Launch of EU Pact for Skills to Mobilize 2 Billion Euro Investment in Microelectronics Talent

BRUSSELS, Belgium – November 30, 2020 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced strong support for the Pact for Skills launched by European Commissioners Nicolas Schmit and Thierry Breton to help reskill…

Preparing the European Microelectronics Workforce for the AI Era

By Yanying Li and Pushkar P. Apte While Artificial Intelligence (AI) emerged in the 1950s, only in recent years have AI applications proliferated with the explosion of data and continuing improvements in Moore’s law that have driven rising processing speeds. Voice assistants, image...

The Digital ERACON – CAREER-EU 2020

Online, 18 November, 2020   METIS 2020 achievements and the next steps planned in 2021-2022, were presented last week at the digital ERACON - CAREER-EU 2020 event. The methodology to identify the trends and needs, including preliminary results of focus...
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