ECoVEM policy-makers roundtable organized by INES

ECoVEM policy-makers roundtable organized by INES on 13th October 2022 in Grenoble, France where also METIS has been presented. The round-table “The skills and attractiveness of microelectronics:  meeting the needs of the European market through initial and continuous vocational training”…

European Cluster Conference

On September 28, 2022, Metis took part in the European Cluster Conference in Prague. Learn more about the conference here.

SEMI Europe Urges Swift Adoption of European Chips Act

BRUSSELS, Belgium ─ May 30, 2022 ─ SEMI Europe, the industry association that unites the entire electronics manufacturing and design supply chain in Europe, today urged swift adoption of the European Chips Act and invited discussions on the legislation with the European Parliament, Member States…

Consortium Meeting in Brussels

May 30, 2022 - Consortium meeting in Brussels.

Digital sovereignty: Commission proposes Chips Act to confront semiconductor shortages and strengthen Europe’s technological leadership

European Commission Press Release, February 8, 2022, Brussels Today, the Commission proposes a comprehensive set of measures to ensure the EU’s security of supply, resilience and technological leadership in semiconductor technologies and applications. The European Chips Act will bolster Europe’s competitiveness, resilience…

Virtual Workshop on New Job Profiles for the Microelectronics Sector

The METIS consortium has proposed four new job profiles following the current ESCO (European Skills, Competences and Occupations) job profile template. ESCO is the European multilingual classification of Skills, Competences and Occupations.  ESCO works as a dictionary, describing, identifying and...

Building the European Microelectronics Talent Pipeline: 5 Takeaways from Inaugural METIS Consortium Meeting

Taking aim at the workers and job training needed to drive microelectronics innovation, 50 members of the recently formed Microelectronics Training, Industry and Skills (METIS) consortium met for the first time in November 2019 to lay out the broad outlines…

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