METIS at 3D & Systems Summit 2023

The recently concluded 3D & Systems Summit 2023, held in Dresden, Germany, included material that promoted METIS.

The SEMI 3D & Systems Summit was dedicated to Smarter Systems through Heterogeneous Integration. Industry experts shared their insights into 3D and Heterogeneous Integration Roadmap (HIR) processes for semiconductor manufacturing and applications.

METIS was represented with flyers and a rollup that invited guests to learn more about the project.